Ultra-tensile-strength sawing wire for the abrasive cutting of various crystals and hard brittle materials is in great demand in the spheres of solar cells production, LED manufacturing and microelectronics.
Principle of cutting a crystal using a wire
In the photovoltaic (PV) industry, such wire is used for cutting mono- and polycrystalline silicon into silicon wafers. As in the PV industry, sawing wire is used in microelectronics to produce thin (0.12-1.50 mm) silicon wafers from monocrystalline silicon. The number of silicon wafers produced worldwide is growing rapidly every year, triggering an increased demand for the sawing wire.
Structure of the wire surface
Cutting Edge Technologies and Advanced Wire Technologies use the innovative technology of plasma surface treatment in the manufacture of sawing wire. The technology improves wire performance characteristics, enhances quality, and lowers wire conversion costs. As a result, wire breaks occur half as often and the product costs 20 percent less than wire from the global market leaders. The production technology includes five steps: wire rod surface treatment and break-down dry drawing, intermediate patenting, intermediate drawing, fine patenting and (brass) plating, and wet drawing.
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